Req. ID: 234581
Assembly Process Engineer – Post Encapsulation
As a Post Encapsulating (Laser Mark/Solder Ball Placement/ Package Singulation/Open Short Test) Process Engineer you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC methodology. Additional responsibilities include coordinating and carrying out process, equipment and material evaluation/optimization to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications and managing, auditing and liaising with material suppliers to achieve quality, cost and risk management objectives.
Responsibilities and Tasks :
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form
Keywords: Penang || Pulau Pinang (MY-07) || Malaysia (MY) || Backend Manufacturing || College || Regular || Engineering || #LI-JT2 || Tier 3 ||
About Micron Technology
Micron Technology is a semiconductor company that produces DRAM, SDRAM, flash memory, SSD and CMOS image sensing chips.
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